Specifications
- ColorStyle :C
- Retail Packaging :No Package
- User Manual (Language) :No User Manual
- Gross Weight :0.017kg
- Volume Weight :0.002kg
- Length :3.500cm
- Width :1.600cm
- Height :1.600cm
- Weight :0.015kg
- EAN :
- With Retail Packaging :Yes
Product Description
1 Bottle Tin BGA Reballing Solder Balls for BGA Rework Repair Tools - Diameter: 0.25mm
Brand new and high quality
Solder tin paste is the best choice of reballing IC
It is used instead of the pin in the IC component package structure
Specification:
Brand: BEST
Model: 505
Material: tin
Diameter: 0.2mm~0.65mm
Flux content: 63%
Melting point: 183°C
Working temperature: 200-380°C
Quantity: 25,000pcs per bottle
Balls alloy: Sn63/Pb37
Size: 35x16mm
Package included:
- 1 x 1 Bottle Tin BGA Reballing Soldering Balls