MIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch
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Item No.: 231401737A Ships in 1 - 3 days MOQ: 1
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Specifications
- Retail Packaging :Colored Box
- User Manual (Language) :No User Manual
- Gross Weight :0.504kg
- Volume Weight :0.158kg
- Length :15.700cm
- Width :15.000cm
- Height :3.000cm
- Weight :0.450kg
- EAN :
- With Retail Packaging :Yes
Product Description
MIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch
MJ 2 in 1 BGA Reballing Stencil Platform Jig Fixure is professional BGA Reballing Stencil Fixture for iPhone 11, motherboard BGA reballing fixture tool, is used for positioning and reballing PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone 11 BGA reballing and repairing.
Install the cell phone main board on the platform
Cover the cell phone BGA reballing stencil on mainboard
Evenly spread tin on the cover of the reballing stencil
Remove the reballing stencil cover
Take out the motherboard and cooperate with the hot air gun to solidify the tin point
Compatible with:
- iPhone 11 Pro Max
- iPhone 11 Pro
Package included:
- 1 x MiJing K30 Mobile Phone Mainboard Special Fixture for Planting Tin for Phone 11 Pro 5.8 inch/11 Pro Max 6.5 inch

