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MR. YANG Solder Paste Welding Grease No Clean Fast Wetting for Mobile Phone Electronics Repair - 183?
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Item No.: 6616001683D Ships in 1 - 3 days MOQ: 1
| 1+ units | 2+ units | 10+ units | 30+ units | 60+ units | 150+ units |
| $4.60 | $4.50 | $4.40 | $4.31 | $4.17 | $4.07 |
Contact Sales Manager
- [email protected]
- Ipartsexpert - Ada Shi
+86 - 18620397679
Specifications
- Brand :N/A
- ColorStyle :D
- Gross Weight :0.056kg
- Volume Weight :0.011kg
- Length :4.000cm
- Width :4.000cm
- Height :3.000cm
- Weight :0.050kg
- EAN :
- PackageLength :59.000cm
- PackageWidth :40.000cm
- PackageHeight :35.000cm
- PackageQuantity :320
- With Retail Packaging :No
Product Description
MR. YANG Solder Paste Welding Grease No Clean Fast Wetting for Mobile Phone Electronics Repair - 183?
- 【Multi-Temperature Selection】Four temperature grades available (140℃, 160℃, 183℃, 199℃) to meet different electronic repair requirements, especially for mobile phone motherboard repairs.
- 【Superior Welding Performance】No cold solder joints, no-clean formula with fast wetting properties ensures excellent wettability and bright, plump solder joints.
- 【Professional Grade Quality】Specifically designed for precision electronic repairs including mobile phone motherboard BGA and QFN component soldering applications.
- 【Minimal Residue Formula】Low residue composition reduces post-soldering cleanup requirements while maintaining professional-grade performance standards.
- 【Sealed Protection Design】Black container with color-coded cap provides excellent sealing to prevent oxidation and maintain product freshness.
Specifications:
- Temperature Grades: 140℃, 160℃, 183℃, 199℃ (4 options)
- Product Weight: 50g
- Dimensions: Ø40mm x H31mm
Package included:
- 1 x Solder Paste
